優(yōu)勢(shì)產(chǎn)品：燒結(jié)銀、無(wú)壓燒結(jié)銀，有壓燒結(jié)銀，半燒結(jié)納米銀膏、導(dǎo)電膠、導(dǎo)電銀漿、導(dǎo)電油墨、銀/氯化銀、納米銀漿、可拉伸銀漿、燒結(jié)銀膜、納米焊料鍵合材料、UV銀漿、光刻銀漿、UV膠、導(dǎo)熱絕緣膠、DTS預(yù)燒結(jié)銀焊片、導(dǎo)電銀膜、銀玻璃膠粘劑，納米銀墨水、納米銀膠、納米銀膏、可焊接低溫銀漿、高導(dǎo)熱銀膠、導(dǎo)電膠等產(chǎn)品，擁有完善的納米顆粒技術(shù)平臺(tái)，金屬技術(shù)平臺(tái)、樹脂合成技術(shù)平臺(tái)、同位合成技術(shù)平臺(tái)，粘結(jié)技術(shù)平臺(tái)等。

加壓燒結(jié)型銀膜 Pressurize sintering Nano silver Film
當(dāng)前位置：善仁新材料科技有限公司 > 產(chǎn)品中心 > 加壓燒結(jié)型銀膜 Pressurize sintering Nano silver Film

Pressureless Silver Sintering Pastes Die-Attach for SiC Power Devices

時(shí)間：2023-05-05 點(diǎn)擊次數(shù)：15061

在線咨詢

SHAREX’s silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These mission profiles typically drive longer high-temperature operating life (HTOL) and larger temperature swings in usage (thermally cycling).

SHAREX'S Silver Sintering Pastes Features & Benefits
Proven fast sintering with excellent joint strength
Pressureless sintering solution with pressurized sintering capabilities
Controllable bondline thickness from 30-70μm
Versatile sintering profiles
Voiding <1%
Porosity <3%
SHAREX‘s Silver Sintering pastes advantage
High reliability
Highest electrical conductivity
High thermal conductivity
Higher than Cu
High temperature applications
Less reactive than Cu